Advanced opto-electronic and optical fiber packaging

Advanced opto-electronic and optical fiber packaging

Description: 

OE packages for CPO, NPO, XPO, OIO, OCI, OCS and so on; Advanced 2.5D/3D packaging of PIC and EIC; Advanced optical fiber packaging and fiber assembly unit; Optical interposer and bridge; Micro and meta lens and packaging devices by silicon, silica, and so on;

Time: TBD

Venue: TBD

Organizers:

TBD

Speakers:

TBD