Tutorial & Invited Speakers

Martin D. Dawson, University of Strathclyde, UK

Anna Peacock, University of Southampton, UK

Baicheng Yao, University of Electronic Science and Technology of China, China

Dieter Bimberg, CIOMP of CAS, China and TU Berlin, Germany

Kenneth Grattan, University of London, UK

Boon S. Ooi, King Abdullah University of Science and Technology, Saudi Arabia

Chao Lu, Sun Yat-sen University, China

Yuping Chen, Shanghai Jiao Tong University, China

Neil Broderick, The University of Auckland, New Zealand

Fei Peng, Huazhong University of Science and Technology, China

Leslie A. Rusch, Universite Laval, Canada

Liang Wang, Huazhong University of Science and Technology, China

Satoshi Iwamoto, The University of Tokyo, Japan

Shikui Shen, China Unicom, China

Jesse Simsarian, Nokia Bell Labs, USA

Ji Zhou, Jinan University, China

Binbin Guan, Microsoft, USA

Yawei Yin, Microsoft, USA

Yi Cai, Soochow University, China

Ching Eng Png, Institute of High Performance Computing, A*Star, Singapore

Chun Sun, Huawei Technologies, China

Yan Hong, University of Electronic Science and Technology, China

Lei Wei, Nanyang Technological University, Singapore

Kenneth Kin-Yip Wong, The University of Hong Kong, China

Tarik Taleb, University of Oulu, Finland

Yongli Zhao, Beijing University of Posts and Telecommunications, China

Yuancheng Fan, Northwestern Polytechnical University, China

Yuanlin Zheng, Shanghai Jiao Tong University, China

Qijie Wang, Nanyang Technological University, Singapore

Wei Jin, The Hong Kong Polytechnic University, China

Wei Li, CIOMP, Chinese Academy of Sciences, China

Shilong Pan, Nanjing University of Aeronautics and Astronautics, China

Aaron Ho-Pui Ho, The Chinese University of Hong Kong, China

Luming Zhao, Huazhong University of Science and Technology, China

Sulaiman Wadi Harun, University of Malaya, Malaya

Yongkang Dong, Harbin Institute of Technology, China

Yongli Zhao, Beijing University of Posts and Telecommunications, China

Thas Nirmalathas, The University of Melbourne, Australia

Tian Jiang, National University of Defense Technology, China

Wei Chen, Fudan University

Wei Ding, Jinan University, China

Wei Jiang, Nanjing University, China

Chao Wang, University of Kent, UK

Xiaofeng Li, Soochow University, China

Dawn Tan, Singapore university of Technology and Design, Singapore

Hoon Kim, Korea Advanced Institute of Science and Technology, South Korea

Qiaoqiang Gan, King Abdullah University of Science and Technology, Saudi Arabia

Haoshuo Chen, Nokia Bell Labs, USA

Hugo Enrique Hernandez-Figueroa, University of Campinas, Brazil‎

Hui Hu, Shandong University, China

William Shieh, The University of Melbourne, Australia

Qiang Lin, University of Rochester, USA

Mable Fok, University of Georgia, USA

Ju Han Lee, University of Seoul, South Korea

Jun He, Shenzhen University, China

Pavel Cheben, National Research Council, Canada

Ravi Silva, University of Surrey, UK

René Bonk, Nokia, Bell Labs, USA

Juan-Pablo Correa-Baena, Georgia Insitute of Tehchnology, USA

Anirban Dhar, CSIR-Central Glass & Ceramic Research Institute, India

Aldo Di Carlo, University of Rome Tor Vergata, Italy

Gang Li, Hong Kong Polytechnic University, China

Gangxiang Shen, Soochow University, China

Dongling Ma, Institut national de la recherche scientifique (INRS), Canada

Gongqiang Li, Institute of Advance Materials, Nanjing Tech University, China

Xuhan Guo, Shanghai Jiao Tong University, China

Deepak Jain, Indian Institute of Technology Bombay, India

Simon Groeblacher, Delft University of Technology, Netherlands

Stefan Maier, Monash University, Australia

Qiuqiang Zhan, South China Normal University, China

Gordon Ning Liu, Soochow University, China

Yuxi Tian, Nanjing University, China

Yuye Wang, Tianjin University, China

Zhangqi Song, Southern University of Science and Technology, China

Weidong Xu, Northwestern Polytechnical University, China

Jun Qian, Zhejiang University, China

Liangcheng Wang, Central South University, China

Xiang Hao, Zhejiang University, China

Xiaowei Sun, Southern University of Science and Technology, China

Xiaohu Wu, Shandong Institute of Advanced Technonogy, China

Tao Ye, Northwestern Polytechnical University, China

Feng He, Southern University of Science and Technology, China

Yi Yang, Wuhan University, China

Yingzhuang Liu, Huazhong University of Science and Technology, China

Yonghui Tian, Lanzhou University, China

Hui Yang, Shenzhen Institute of Advanced Technology, CAS, China

Jinhong Guo, Shanghai Jiao Tong University, China

Peng Xi, Peking University, China

Pu Li, Taiyuan University of Technology and Guangdong University of Technology

Admela Jukan, TU Braunschweig, Germany

Maite Brandt-Pearce, University of Virginia, USA

Johannes Fink, IST Austria, Austria

Lei Bi, University of Electronic Science and Technology of China, China

Huiyun Liu, University College London, UK

Jianji Dong, Huazhong University of Science and Technology, China

Jian-Jun He, Zhejiang University, China

Hui Jing, Hunan Normal University, China

Lei Shi, Fudan University, China

Mengxin Ren, Nankai University, China

Bi-Heng Liu, University of Science and Technology of China, China

Chun-Hua Dong, University of Science and Technology of China, China

Guixin Li, Southern University of Science and Technology, China

Haifei Lu, Wuhan University of Technology, China

Xiulai Xu, Peking University, China

Ling Lu, University of Science and Technology of China, China

Yuri Kivshar, Australian National University, Australia

Junsuk Rho, Pohang University of Science and Technology, South Korea

Junwen Zhang, Fudan University, China

Fufei Pang, Shanghai University, China

Qizhen Sun, Huazhong University of Science and Technology, China

Xiaoke Yi, University of Sydney, Australia

Xingyuan Xu, Beijing University of Posts and Telecommunications, China

Xinhai Zhang, Southern University of Science and Technology, China

Xinlun Cai, Sun Yat-sen University, China

Xinyong Dong, Guangdong University of Technology, China

Guiling Wu, Shanghai Jiao Tong University, China

Jinsong Xia, Huazhong University of Science and Technology, China

Jintian Lin, Shanghai Institute of Optics and Fine Mechanics, CAS, China

Jinghua Teng, IMRE, A*STAR, Singapore

Huan Li, Zhejiang University, China

Zi-Hui Zhang, Hebei University of Technology, China

Fei Yu, Shanghai Institute of Optics and Fine Mechanics, China

Xianfeng Chen, Shanghai Jiao Tong University, China

Xifeng Ren, University of Science and Technology of China, China

Xingjun Wang, Peking University, China

Weihua Guo, Huazhong University of Science and Technology, China

Zi-Lan Deng, Jinan University, China

Feng Chen, Shandong University, China

Huihui Lu, Jinan University, China

Liu Liu, Zhejiang University, China

Zhen Tian, Tianjin University, China

Zhicheng Ye, Huawei Technologies, China

Lilin Yi, Shanghai Jiao Tong University, China

Fang-Wen Sun, University of Science and Technology of China, China

Hongwei Chen, Tsinghua University, China

Wenjing Jie, Sichuan Normal University, China

Yaocheng Shi, Zhejiang University, China

Wenfu Zhang, Xi’an Institute of Optics and Precision Mechanics, CAS, China

Fanchao Meng, Jilin University, China

Fang Bo, Nankai University, China

Meng Pang, Shanghai Institute of Optics and Fine Mechanics, China

Dezhi Zhang, China Telecom Research Institute, China

Diming Yu, Nanjing Jianqiao Energy Tech, China

Jialong Li, Southern University of Science and Technology, China

Yanlong Niu, National University of Singapore, Singapore

Zhengting Wu, Southern University of Science and Technology, China

Dora Juan Juan Hu, Institute for Infocomm Research, Singapore

Fang Gang, National University of Singapore, Singapore

Wakana Kubo, Tokyo University of Agriculture and Technology, Japan

Guodong Shao, Wuhan Huaray Precision Laser Co.,Ltd, China

Jingshu Guo, Zhejiang University, China

Jinyu Mo, POET Technologies, China

Zejie Yu, Zhejiang University, China

Ping Zhao, Chalmers University of Technology, Sweden

Mengyue Xu, Sun Yat-sen University, China

Liangchuan Li, HUAWEI, China

Gustavo Wiederhecker, University of Campinas, Brazil

Hansuek Lee, Korea Advanced Institute of Science and Technology, South Korea

Aaron Danner, National University of Singapore, Singapore

Baiquan Liu, Sun Yat-sen University, China

Bing Xiong, Tsinghua University, China

Nripan Mathews, Nanyang Technological University, Singapore

Lan-Tian Feng, University of Science and Technology of China, China

Dangyuan Lei, City University of Hong Kong, China

Guancong Ma, Hong Kong Baptist University, China

Kebin Shi, Peking University, China

Ren-Min Ma, Peking University, China

Rui Min, Beijing Normal University, China

Weibo Gao, Nanyang Technological University, Singapore

Ruijun Wang, Sun Yat-sen University, China

Xiaoyu Zhang, Jilin University, China

Cristina Rottondi, Politecnico di Torino, Italy

Dan Luo, Southern University of Science and Technology, China

Luqi Yuan, Shanghai Jiao Tong University, China

Zhen Gao, Southern university of Science and Technology, China

Xiaosheng Xiao, Beijing University of Posts and Telecommunications, China

Feng Lan, University of Electronic Science and Technology of China, China

Fucai Zhang, Southern University of Science and Technology, China

Su Xu, Jilin University, China

Junqing Zhao, Shenzhen Technology University, China

Yiyang Luo, Chongqing University, China

Wenjun Ni, South-Central Minzu University, China

Wu Zhang, Guangzhou University, China

Xiankai Sun, The Chinese University of Hong Kong, China

Xiaojun Yu, Northwestern Polytechnical University, China

Bo Lv, Harbin Engineering University, China

Longqing Cong, Southern University of Science and Technology, China

Li Shen, Huazhong University of Science and Technology, China

Liang Mu, O-Net Communications(Shenzhen) Limited, China

Mengmeng Chen, Nanjing University, China

Yizhu Zhang, Tianjin University, China

Houxiao Wang, Shandong University of Technology, China

Hui Li, Shenzhen Institute of Advanced Technology, CAS, China

Liang Wu, Tianjin University, China

Kai Wang, Southern University of Science and Technology, China

Shuhua Yue, Beihang University, China

Ruoming Li, Aerospace Information Research Institute, CAS, China

Shan Yin, Guilin University of Electronic Technology, China

Nuannuan Shi, Institute of Semiconductors,CAS, China

Paolo Monti, Chalmers University of Technology, Sweden

Rachel Grange, ETH Zurich, Switzerland

Xuming Zhang, Hong Kong Polytechnic University, China

Yanping Li, Peking University, Chin

Yang Li, Tsinghua University, China

Yanjun Liu, Southern University of Science and Technology, China

David Northeast, National Research Council Canada, Canada

Derrick Yong, Endofotonics, Singapore

Shaoyang Ma, Beijing Jiaotong University, China

Jiang Li, Institute of Fluid Physics, CAEP

Jie Li, Chengdu University of Information Technology, China

Jiayu Zhao, University of Shanghai for Science and Technology, China

Han Li, China Mobile, China

Gengchen Liu, Huawei Technologies, China

Di Zhang, Nankai University, China

Tingting Lv, Northeast Petroleum University, China

Chenglin Xu, Synopsys, Inc., USA

Jun Li, Soochow University, China

Rudi Bratovich, SM-OPTICS, Italy

Minglu Cai, Shanghai Jiao Tong University, China

Liangjia Zong, Huawei Technologies, China

Nicola Sambo, Scuola Superiore Sant'Anna, Italy

Min Xue, Nanjing University of Aeronautics and Astronautics, China

Pei Zhou, Soochow University, China

Kumar Appaiah, Indian Institute of Technology Bombay, India

Kejie Fang, University of Illinois at Urbana-Champaign, USA

Lin Chang, Peking University, China

Linbo Shao, Virginia Tech, USA

Mengjie Yu, University of Southern California, USA

Qiancheng Zhao, Southern University of Science and Technology, China

Abhishek Srivastava, Hong Kong Uiversity of Science and Technology, China

Chao Xiang, The University of Hong Kong, China

Chaoran Huang, The Chinese University of Hong Kong, China

Young-Ik Sohn, Korea Advanced Institute of Science and Technology, South Korea

Qifan Yang, Peking University, China

Chengying Bao, Tsinghua University, China

Donguk Nam, Nanyang Technological University, Singapore

Jonathan Halpert, The Hong Kong University of Science and Technology, China

Wei Yan, Nanyang Technological University, Singapore

Cheng Wang, City University of Hong Kong, China

Wonkeun Chang, Nanyang Technological University, Singapore

Xiaolong Chen, Southern University of Science and Technology, China

Bitao Pan, Beijing University of Posts and Telecommunications, China